Description
- Two-part, tan, electrically conductive RTV silicone
- Designed to cure at room temperature and at elevated temperatures
- 20:1 Mix Ratio (Part A:Part B)
Applications
- For RF and EMI shielding for electrical and aerospace applications
- Excellent for formed-in-place conductive gaskets and grounding connections
- Use to adhere covers on housings or where grooves or other configurations require a non-flowable to limited flow material
Product Details
| Property | Average Result |
|---|---|
| Volume Resistivity | |
| Cure System | |
| Durometer | |
| Tensile | |
| Appearance | |
| Cure | |
| Dielectric Strength | |
| Elongation | |
| Mix Ratio | |
| Specific Gravity | |
| Tack Free Time | |
| Thermal Conductivity | 1.5 W/(mK) |
| Work Time | 4 hours |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.