• Two-part, translucent, thixotropic, high tear strength silicone system
  • Cures rapidly with the application of heat in an oven, or by a heat gun or lamp
  • Many bonding applications do not require the use of a silicone primer for suitable adhesion
  • Does not require atmospheric moisture to cure
  • No curing byproducts such as acetic acid or methyl alcohol
  • Consistency allows product to be supplied in easy-to-use, airless side-by-side kits that eliminate mixing and deairing difficulties
  • 1:1 Mix ratio (Part A:Part B)


  • Adhesive for bonding and sealing silicones to each other and other substrates such as metals and plastics
  • For rapid production or prototyping due to a rapid cure

Product Details

Property Average Result
Cure System Platinum
Viscosity 170,000 cP (170,000 mPa*s)
Extrusion Rate 15 g/minute
Lap Shear 150 psi (1.03 MPa)
Durometer 15 Type A
Appearance Translucent
Cure 15 minutes / 150 °C
Dielectric Strength 905 volts/mil (35.3 kV/mm)
Elongation 850 %
Flow Rate 0.5 in (12.7 mm)
Mix Ratio 1:1
Specific Gravity 1.12
Stress at Strain 35 psi / 100 % (0.24 MPa / 100 %)
Tear 125 ppi (22.05 kN/m)
Tensile 975 psi (6.72 MPa)
Work Time 15 hours
Comment Primerless Adhesive;Heat Cure. Flow 0.5 per 5 minutes. Requires heat to cure. 150 psi (1.0 MPa), unprimed lap shear.


The diverse line of NuSil® adhesives specifically designed for electronic component assembly increases production throughput without sacrificing performance.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.