Description
- Two-part, white, thermally conductive silicone
- Cure may be heat accelerated
- 15:1 Mix Ratio (Part A:Part B)
Applications
- To provide heat transfer between electrical/electronic components and their heat sinks
- For use in extreme low temperature applications
- Use for adhering openings in modules and housing where grooves or other configurations require a limited flow material with moderate thermal conductivity
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.75 W/(mK) |
| Viscosity | |
| Cure System | |
| Tensile | |
| Appearance | |
| Cure | |
| Dielectric Strength | |
| Durometer | |
| Elongation | |
| Mix Ratio | |
| Specific Gravity | |
| Tear | |
| Work Time | 3.5 hours |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.