Description
- Two-part, gray, thermally conductive silicone with high strength
- Cure may be heat accelerated
- 20:1 Mix Ratio
- (Part A:Part B)
Applications
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates and heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.84 W/(mK) |
| Cure System | |
| Tensile | |
| Appearance | |
| Cure | |
| Dielectric Strength | |
| Durometer | |
| Elongation | |
| Mix Ratio | |
| Specific Gravity | |
| Tack Free Time | |
| Tear | |
| Work Time | 5 hours |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.