Description
- Two-part, white, thermally conductive silicone
- Cure may be heat accelerated
- 15:1 Mix Ratio (Part A: Part B)
Applications
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 1.46 W/(mK) |
| Cure System | Platinum |
| Tensile | 260 psi (1.79 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Dielectric Strength | 880 volts/mil (34.32 kV/mm) |
| Durometer | 80 Type A |
| Elongation | 20 % |
| Flow Rate | 0.3 inches (7.62 mm) |
| Mix Ratio | 15:1 |
| Operating Temperature | -65 °C / 240 °C |
| Specific Gravity | 1.55 |
| Work Time | 3 hours |
| Comment | Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride) |
Contact NuSil™ to Order Now
For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.