• Two-part, white, thermally conductive silicone
  • Cure may be heat accelerated
  • 15:1 Mix Ratio (Part A: Part B)


  • To provide heat transfer between electrical/electronic components and their heat sinks
  • Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material

Product Details

Property Average Result
Thermal Conductivity 1.46 W/(mK)
Cure System Platinum
Tensile 260 psi (1.79 MPa)
Appearance White
Cure 30 minutes / 150 °C
Dielectric Strength 880 volts/mil (34.32 kV/mm)
Durometer 80 Type A
Elongation 20 %
Flow Rate 0.3 inches (7.62 mm)
Mix Ratio 15:1
Operating Temperature -65 °C / 240 °C
Specific Gravity 1.55
Work Time 3 hours
Comment Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)

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For over 40 years, the NuSil brand has offered a wide range of high-purity silicones. Our team is ready to collaborate with you to provide silicone solutions to satisfy your unique requirements. For additional guidance during your selection process, or to order a sample, contact NuSil today.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.