Description
- Two part, Black, 1:1 Mix ratio (A:B)
- Pourable and self-leveling
- Cures at room temperature
- REACh and RoHS compliant
- Tested per UL-94 and passed V-0
Applications
- Thermally stable, flowable material that cures at room temperature
- Low viscosity allows the potting of complex geometries without the entrapment of air
- Applications include: potting for connectors, sensors, relays, power devices and other electronic components requiring protection from vibration and generally harsh environmental conditions
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.4 W/(mK) |
| Viscosity | 2,000 cP (2,000 mPa*s) |
| Cure System | Platinum |
| Tensile | 525 psi (3.62 MPa) |
| Appearance | Black |
| Cte | |
| Cure | 60 minutes / 150 °C |
| Dielectric Strength | 580 volts/mil (22.62 kV/mm) |
| Durometer | 50 Type A |
| Elongation | 130 % |
| Mix Ratio | 1:1 |
| Volume Resistivity | 43,000,000,000,000 ohmcm |
| Work Time | 1 hours |
| Comment | 0.4 W/mk, pourable, heat resistant, tested per UL94 and passed V0. Will RTV. |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.