Description
- Two part, Gray, 1:1 Mix ratio (A:B)
- Pourable and self-leveling
- Cures at room temperature
- REACh and RoHS compliant
Applications
- Enhanced thermal conductivity for removal of heat and improved reliability
- Low viscosity allows the potting of complex geometries without the entrapment of air
- Quick set-up and flexible cure schedule
- Applications include: potting for sensors, relays, and other electronic components requiring protection from vibration and generally harsh environmental conditions
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.5 W/(mK) |
| Viscosity | |
| Cure System | |
| Tensile | |
| Appearance | |
| Cte | |
| Cure | |
| Dielectric Strength | |
| Durometer | |
| Elongation | |
| Mix Ratio | |
| Volume Resistivity | |
| Work Time | 10 minutes |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.