GEL-8127
HIGH PURITY DIELECTRIC SILICONE GEL
Description
- Medium to Firm silicone gel
- Low viscosity allows easy mixing and de-airing
- 1:1 Mix Ratio (Part A: Part B)
- Platinum Cure
- RoHS compliant
Applications
- For use as an embedding or potting compound for protection of electronic assemblies and components from environmental contamination
- Provide excellent stress relief for thermal cycling of sensitive components such as wire bonds and thin wafers
- Electrically insulating and non-conductive
- Ideal for potting and filling intricate assemblies
- Ideal for use in automated dispensing equipment
Product Details
| Property | Average Result |
|---|---|
| Viscosity | 530 cP (530 mPa*s) |
| Penetration | 8 mm |
| Appearance | Translucent |
| Cure | 35 minutes / 150 °C |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.