Description
- Two-part, white, thermally conductive, low viscosity silicone elastomer
- Cures with the addition of heat
- 1:1 Mix Ratio (Part A: Part B)
Applications
- For applications requiring a low volatility, conformal, thermally conductive silicone
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a limited flow material
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 0.95 W/(mK) |
| Viscosity | 36,000 cP (36,000 mPa*s) |
| Cure System | Platinum |
| Tensile | 180 psi (1.24 MPa) |
| Appearance | White |
| Cure | 14 minutes / 150 °C |
| Dielectric Strength | 465 volts/mil (18.14 kV/mm) |
| Durometer | 65 Type A |
| Elongation | 50 % |
| Ionic Content Cl | <5 ppm |
| Ionic Content K | <3 ppm |
| Ionic Content Na | <5 ppm |
| Lap Shear | 120 psi (0.83 MPa) |
| Mix Ratio | 1:1 |
| Specific Gravity | 2.34 |
| Tack Free Time | 13 hours |
| Volatile Content | 0.35 % |
| Volume Resistivity | 34,000,000,000,000 ohmcm |
| Comment | Recommended for bondlines 5 micron or greater. |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.