Description
- Two-part, white, thermally conductive, electrically insulating, silicone system
- Electrically insulative and non-corrosive
- 15:1 Mix Ratio (Part A: Part B)
Applications
- Flexible Thermal interface material (TIM) designed to provide heat transfer between electrical/electronic components and their heat sinks for a variety of component level packaging
- For applications requiring a broad operating temperature range
- Ideal where a form-in-place TIM is needed for use as a sealing, caulking, adhesive, or potting material in electronics applications requiring minimal volatility for prevention of contamination in sensitive devices
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 1.49 W/(mK) |
| Viscosity | |
| Cure System | |
| Tensile | |
| Appearance | |
| Durometer | |
| Elongation | |
| Flow Rate | 0.3 in (7.62 mm) |
| Ionic Content Cl | <3 ppm |
| Ionic Content K | <3 ppm |
| Ionic Content Na | <6 ppm |
| Lap Shear | 160 psi (1.1 MPa) |
| Mix Ratio | |
| Specific Gravity | |
| Tack Free Time | |
| Tear | |
| Work Time | 2 hours |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.