• Two-part film adhesive
  • Cures at room temperature or rapidly with heat


  • For electronic and space applications requiring low outgassing and minimal volatile condensables to avoid condensation in sensitive devices
  • For bonding or sealing silicone elastomers and some metals or plastics
  • For applications requiring shorter work times, easy clean-up, and consistent bond thickness
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%

Product Details

Property Average Result
Appearance Translucent
Cure 4 hours / 65 °C
Cure System Platinum
Cure Type RTV
Elongation 850 %
Lap Shear 250 psi (1.7 MPa)
Rheology Thixotropic / Non-slump
Substrate Primerless: ABS / Aluminum / Glass / Metal / PEEK / Plastic / PMMA / Polycarbonate / Polyetherimide / Polymide / Polyurethane / Silicone / Stainless steel / Titanium
Tear 115 ppi (20.3 kN/m)
Tensile 1,450 psi (10.0 MPa)


The diverse line of NuSil® adhesives specifically designed for electronic component assembly increases production throughput without sacrificing performance.

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.