Description
- Two-part, electrically conductive film adhesive
Applications
- For electronic and space applications requiring low outgassing and minimal volatile condensables to avoid condensation in sensitive devices
- Use for RFI and EMI shielding in electrical and space applications
- For bonding or sealing silicone elastomers and some metals or plastics
- For applications requiring shorter work times, easy clean-up, and consistent bond thickness
- For applications requiring a broader operating temperature range
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of ≤1% and CVCM of ≤0.1%
Product Details
| Property | Average Result |
|---|---|
| Cure System | Platinum |
| Appearance | Black |
| Cure | 4 hours / 65 °C |
| Volume Resistivity | 150 ohmcm |
| Comment | Use for RFI and EMI shielding in electrical and space applications. For applications requiring shorter work times, easy clean-up, and consistent bond thickness. |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.