Description
- A two-part, thixotropic compound
- 15:1 Mix Ratio (Part A:B)
- Provides thermal conductivity when cured
- Cures at room or temperature or rapidly with heat
Applications
- Provides heat transfer between electrical/electronic components and heat sinks
- For use as a sealant, adhesive or molding material requiring solvent resistance
- Use to adhere covers on housings or where grooves or other configurations require a non-flowable material
- For applications requiring an operating temperature range of -65°C to 225°C (-85°F to 437°F)
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 1.25 W/(mK) |
| Cure System | Platinum |
| Tensile | 125 psi (0.86 MPa) |
| Appearance | White |
| Cure | 30 minutes / 150 °C |
| Durometer | 50 Type A |
| Elongation | 50 % |
| Mix Ratio | 15:1 |
| Specific Gravity | 1.53 |
| Work Time | 90 minutes |
| Comment | 50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride) |
Specialty Silicones for Displays
The NuSil® line of optoelectronic silicones enable device manufacturers from smart phones to stadium screens and everything in between to create next-generation displays that are sharper, brighter and more rugged.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.