Description
- A two-part, thixotropic compound
- 15:1 Mix Ratio (Part A:B)
- Provides thermal conductivity when cured
- Cures at room or temperature or rapidly with heat
Applications
- Provides heat transfer between electrical/electronic components and heat sinks
- For use as a sealant, adhesive or molding material requiring solvent resistance
- Use to adhere covers on housings or where grooves or other configurations require a non-flowable material
- For applications requiring an operating temperature range of -65°C to 225°C (-85°F to 437°F)
Product Details
| Property | Average Result |
|---|---|
| Thermal Conductivity | 1.25 W/(mK) |
| Cure System | |
| Tensile | |
| Appearance | |
| Cure | |
| Durometer | |
| Elongation | |
| Mix Ratio | |
| Specific Gravity | |
| Work Time | 90 minutes |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.