Description
- A solvent-free, thermosetting resin
- Forms a transparent, rigid material that retains its cured properties over a broad temperature range (up to 300°C/570°F)
- Has good dielectric properties at high temperatures and humidity
- Excellent resistance to radiation
- 100:1 Mix Ratio (CF-4721:Dicumyl Peroxide)
Applications
- For encapsulating electrical and electronic units
- For electronics and photonics applications
Product Details
| Property | Average Result |
|---|---|
| Refractive Index | |
| Viscosity | |
| Mmol | 4.7 Vi/g |
| Appearance | |
| Cure | |
| Durometer | |
| Mix Ratio | |
| Non Volatile Content | |
| Specific Gravity | |
| Volume Resistivity | |
| Comment |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please contact NuSil for assistance and recommendations in establishing limits for product specifications.