Implant Line
MED-6601 ADDITION CURE SILICONE ELASTOMER SYSTEM
Description
- Cures with heat via addition-cure chemistry
- Intended to be dispersed in solvent at a suggested mix ratio of 100parts Part A: 1part Part B: 1part Part C: 234parts Xylene (or other suitable solvent)
Applications
- Once dispersed, the material is suitable for dip casting and heat-curing of thin elastomeric films
Product Details
| PROPERTY | AVERAGE RESULT |
|---|---|
| Durometer | 24 Type A |
| Appearance | Translucent |
| Elongation | 800 % |
| Stress at Strain | 320 psi / 300 % (2.21 Mpa / 300 %) |
| Tear | 150 ppi (26.46 kN/m) |
| Tensile | 1,200 psi (8.28 MPa) |
| Comment | 100% solids |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.
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