CV1-2960 THERMALLY CONDUCTIVE, CONTROLLED VOLATILITY SILICONE
- Two-part, white, thermally conductive silicone
- Will cure with the addition of heat
- 10: 1 Mix Ratio (Part A: Part B)
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a flowable to limited flow material
| PROPERTY | AVERAGE RESULT |
|---|---|
| Thermal Conductivity | 1.11 W/(mK) |
| Viscosity | 900,000 cP (900,000 mPa*s) |
| Cure System | Platinum |
| Tensile | 250 psi (1.72 MPa) |
| Appearance | White |
| Cure | 4 hours / 65 °C |
| Durometer | 75 Type A |
| Elongation | 60 % |
| Mix Ratio | 10:1 |
| Specific Gravity | 1.45 |
| Tack Free Time | 4 hours |
| Tear | 55 ppi (9.7 kN/m) |
| Work Time | 2 hours |
| Comment | *22) 1.1 W/mK |
