CF2-4721 THERMOSETTING SILICONE RESIN
Description
- A pre-catalyzed, solvent free, thermosetting resin
- Forms a transparent rigid material when heat cured
- Maintains cured properties and good electrical properties over a broad temperature range and in high humidity
Applications
- Designed for impregnating electrical and electronic units in the nuclear power, aerospace and electronic industries
- Provides excellent resistance to radiation
Product Details
| PROPERTY | AVERAGE RESULT |
|---|---|
| Viscosity | 130 cP (130 mPa*s) |
| Durometer | 75 Type D |
| Appearance | Light Amber |
| Cure | 15 minutes / 150 °C |
| Cure System | Peroxide |
| Non Volatile Content | 100 % |
| Refractive Index | 1.52 |
| Specific Gravity | 1.09 |
| Comment | Hard Resin;Contains vinyl-specific peroxide in 1.52 RI resin. Requires heat to cure and oxygen inhibited. Not recommended for general encapsulation. |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.
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