R-2188 SILICONE POTTING AND ENCAPSULATING ELASTOMER

Description

  • Two part, Clear, 1:1 Mix ratio (A:B)
  • Pourable and self-leveling
  • Cures at room temperature
  • REACh and RoHS compliant
  • Tested per UL-94 and passed V-1

Applications

  • For potting, encapsulating and coating of modules, relays, and a variety of AC/DC converters including high power and planar packages
  • Provides protection from moisture, dust and contaminants
  • Increases resistance to shock and vibration
  • Low viscosity allows the potting of complex geometries without the entrapment of air
  • Pot life is compatible with processes that require dispensing or coating with Part A and B combined
  • Dielectric properties compatible with many devices and increase breakdown voltage of device


Product Details

PROPERTYAVERAGE RESULT
Cure SystemPlatinum
Viscosity11,300 cP (11,300 mPa*s)
Durometer20 Type A
Tensile475 psi (3.28 MPa)
Elongation350 %
AppearanceTranslucent
Cte
Cure30 minutes / 150 °C
Dielectric Strength500 volts/mil (19.5 kV/mm)
Ionic Content Cl<5 ppm
Ionic Content K<3 ppm
Ionic Content Na<1 ppm
Mix Ratio1:1
Specific Gravity1.05
Work Time8 hours
CommentExcellent dielectric properties, flexible cure with 14 hr pot life, tested per UL 94 and passed V1.

Encapsulation Technology

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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.

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