LS-3238 ENCAPSULATION GEL
Description
- A two-part, encapsulation gel
- Extended work time
- 1:1 Mix Ratio (Part A:B)
Applications
- For protection of sensitive photonics assemblies from mechanical shock, thermal shock, dust, and ambient atmosphere
- Extended work time allows voids in complex assemblies to fill in and permits time for any trapped air bubbles to float to the fluid surface and escape
- For applications requiring an operating temperature range of -40°C to 200°C (-40°F to 392°F) or for soldering operations up to 260°C (500°F) for 1 to 2 minutes
Product Details
| PROPERTY | AVERAGE RESULT |
|---|---|
| Viscosity | 1,500 cP (1,500 mPa*s) |
| Work Time | 11 hours |
| Appearance | Clear |
| Cure | 30 minutes / 150 °C |
| Cure System | Platinum |
| Durometer | 15 Type 00 |
| Mix Ratio | 1:1 |
| Operating Temperature | -40 °C / 200 °C |
| Refractive Index | 1.38 |
| Specific Gravity | 1.28 |
| Volatile Content | 0.14 % |
| Comment | Resistant to hydrocarbon solvents. Index matches Magnesium Fluoride. Potlife based on 3,000 cPs maximum mixed viscosity after 6hrs |
Encapsulation Technology
Watch our CareSil team explain the breakthrough Encapsulation Technology and demonstrate how easy it is to create transformative formulations with CES.
The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.
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