EPM-2482 LOW VOLATILITY DIELECTRIC SILICONE GEL
Description
- Two-part, clear silicone gel
- Designed for enhanced performance in extreme low and high temperatures
- 1:1 Mix Ratio (Part A: Part B)
Applications
- For applications requiring low volatility
- Useful for potting intricate assemblies due to a low viscosity
- As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components
Product Details
| PROPERTY | AVERAGE RESULT |
|---|---|
| Viscosity | 1,800 cP (1,800 mPa*s) |
| Penetration | 3 mm |
| Appearance | Clear |
| Cure | 40 minutes / 150 °C |
| Cure System | Platinum |
| Ionic Content Cl | <5 ppm |
| Ionic Content K | <1 ppm |
| Ionic Content Na | <4 ppm |
| Mix Ratio | 1:1 |
| Volatile Content | 0.3 % |
| Comment | Soft High Tack Gel;For applications requiring low volatility. Useful for potting intricate assemblies due to a low viscosity. As a low modulus embedding or potting compound for environmental protection of electronic assemblies and components |
Encapsulation Technology
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The test data shown for this material is the average value for typical properties. All of these properties may not be tested on a lot to lot basis and cannot be used to draft specifications. Please Contact NuSil for assistance and recommendations in establishing limits for product specifications.
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