Filters
Applied Filters
All
Refine results
Thermally Conductive
Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Non-Curing
0.68 W/(mK)
Versatile, thermally conductive grease where thin bondlines or a compressible grease is needed. Non-curing.
Platinum
15:1
N/A
N/A
1.25 W/(mK)
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Platinum
10:1
300,000 cP
0.79 W/(mK)
*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp
Platinum
10:1
130,000 cP
0.83 W/(mK)
*22) 0.8 W/mK, *4) Primed Lap Shear 205 psi (1.4 MPa), Low Viscosity
Platinum
15:1
75,000 cP
0.75 W/(mK)
For applications requiring a broader operating temperature range. (Contains Boron Nitride)
Platinum
15:1
3,560,000 cP
1.49 W/(mK)
*22) 1.5 W/mK *,4 ) Primed Lap Shear 160 psi (1.1 MPa)