5 results for "marketSegment=Aviation & Defense"

Thermally Conductive

Product

Cure System

Mix Ratio

Viscosity

Extrusion Rate

Thermal Conductivity

Data Sheet

Comment

Platinum

15:1

N/A

1.25 W/(mK)

50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)

Platinum

15:1

75,000 cP

0.75 W/(mK)

For applications requiring a broader operating temperature range. (Contains Boron Nitride)

Platinum

20:1

0.84 W/(mK)

Smooth Paste;0.8 W/mK, 5 hr. pot life.

Platinum

15:1

70,000 cP

0.75 W/(mK)

0.75 W/mK, 4 hr. pot life. (Contains Boron Nitride)

Platinum

15:1

1.46 W/(mK)

Smooth Paste;1.45 W/mK, 3 hr. pot life. (Contains Boron Nitride)