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Aviation & Defense
Adhesives/Sealants - Aerospace/Defense24Coatings/Dispersions - Aerospace/Defense11Electrically Conductive/Static Dissipative3Foams - Aerospace/Defense4Gels - Aerospace/Defense5Liquid Silicone Rubbers - Aerospace/Defense1Low Viscosity Elastomers - Aerospace/Defense2Primers - Aerospace/Defense6Resins1Specialty Polymers1Thermally Conductive5
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Adhesives/Sealants - Aerospace/Defense
Product
Cure System
Rheology
Durometer
Work Time
Data Sheet
Comment
Tin
8 minutes
For applications requiring extreme temperature and gamma radiation resistance. For potting, sealing and bonding applications. For thermal insulating as a firewall sealant or as an ablative coating in missile, rockets, aircraft and launch equipment.
Tin
2.3 hours
For applications requiring extreme temperature and gamma radiation resistance. For potting, sealing and bonding applications. For thermal insulating as a firewall sealant or as an ablative coating in missile, rockets, aircraft and launch equipment.
Platinum
For applications requiring shorter work times, easy clean-up, and consistent bond thickness
Foams - Aerospace/Defense
Product
Appearance
Cure System
Foam Density
Viscosity
Application Life
Data Sheet
Comment
Gray
Platinum
25 lbs/ft³
90,000 cP
Useful where stability at higher and lower temperatures is required.
Specialty Polymers
Product
Appearance
Refractive Index
Viscosity
% Pt
Mmol
Data Sheet
Comment
Clear
1.52
125 cP
N/A
4.7 Vi/g
75 Type D with Dicumyl Peroxide Catalyst (Catalyst Not Included)
Primers - Aerospace/Defense
Product
Solvent
Non Volatile Content
Data Sheet
Comment
Naptha
15 %
Improved adhesion to gold - Recommended where platinum inhibition is of concern such as when bonding on polyphenylsulphone.
Resins
Product
Appearance
Viscosity
Durometer
Data Sheet
Comment
Light Amber
130 cP
75 Type D
Hard Resin;Contains vinyl-specific peroxide in 1.52 RI resin. Requires heat to cure and oxygen inhibited. Not recommended for general encapsulation.
Thermally Conductive
Product
Cure System
Mix Ratio
Viscosity
Extrusion Rate
Thermal Conductivity
Data Sheet
Comment
Platinum
15:1
N/A
N/A
1.25 W/(mK)
50% M Fluoro. Recommended for short term exposure to solvents and fuel. (Contains Boron Nitride)
Platinum
15:1
75,000 cP
0.75 W/(mK)
For applications requiring a broader operating temperature range. (Contains Boron Nitride)
Coatings/Dispersions - Aerospace/Defense
Product
Cure System
Viscosity
Durometer
Non Volatile Content
Data Sheet
Comment
