For applications requiring extreme temperature and gamma radiation resistance. For potting, sealing and bonding applications. For thermal insulating as a firewall sealant or as an ablative coating in missile, rockets, aircraft and launch equipment.

For applications requiring shorter work times, easy clean-up, and consistent bond thickness

Useful where stability at higher and lower temperatures is required.

Low viscosity fluid

For crosslinking silicone addition cure polymer systems, to form adhesives, sealant, rubbers and gels due to its reactivity with vinyl functional groups

For applications requiring a low viscosity and low volatility soft gel

Versatile, thermally conductive grease where thin bondlines or a compressible grease is needed. Non-curing.

*22) 1.0 W /mK, *5) Primed Lap Shear 120 psi (0.8 MPa)

*22) 0.8 W/mK Low Viscosity, *3) Primed Lap Shear 205 psi (1.4 MPa), Low Temp

Slight addition of heat will accelerate cure